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| Textauszug Calculation of the Temperature Field of a Printed-Circuit Board with Account for Convective and Radiative Heat Exchange on the Board Surface: |
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| The temperature field of a printed-circuit board has been simulated numerically according to the two-dimensional thermal model with account for convective and radiative heat exchange on the board surface. The temperature fields in the actual printed-circuit board have been determined experimentally. The deviation of the results of the numerical analysis from the experimental data does not exceed ±4°C. |
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